首页> 外文会议>International Semiconductor Device Research Symposium;ISDRS '09 >C-V characterization of triple gate (TG) and double gate (DG) silicon on insulator (SOI) FinFETs using self-consistent method: A comparative study
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C-V characterization of triple gate (TG) and double gate (DG) silicon on insulator (SOI) FinFETs using self-consistent method: A comparative study

机译:使用自洽方法对绝缘体(SOI)FinFET上的三栅极(TG)和双栅极(DG)硅进行C-V表征:对比研究

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Capacitance-voltage (C-V) characteristics of triple-gate (TG) and double gate (DG) silicon-on-insulator (SOI) FinFETs having sub 10nm dimensions are obtained by self consistent method using coupled Schrödinger-Poisson solver taking into account quantum mechanical effects. Though self-consistent simulation to determine current and short channel effects in these devices has been reported in recent literature [1]-[2], C-V characterization, which is essential for parameter extraction, high frequency performance evaluation and device modeling, is yet to be done using self-consistent method. We investigate here the C-V characteristics of both these structures with the variation of an important process parameter, the silicon film or fin width.
机译:通过使用耦合Schrödinger-Poisson求解器并考虑量子力学的自洽方法,获得了尺寸小于10nm的三栅极(TG)和双栅极(DG)绝缘体上硅(SOI)FinFET的电容电压(CV)特性效果。尽管最近文献[1]-[2]报道了确定这些器件中电流和短通道效应的自洽仿真,但CV表征对于参数提取,高频性能评估和器件建模至关重要。使用自洽方法完成。我们在这里研究这两种结构的C-V特性,以及重要工艺参数,硅膜或鳍片宽度的变化。

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