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Advanced in Gallium Nitride materials and structures for power electronics

机译:先进的氮化镓材料和用于电力电子的结构

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Gallium Nitride and related group III-Nitride semiconductors have emerged over the past decade as a materials platform for electronic and optoelectronic devices in solid-state lighting (blue, green, white LEDs), optical data storage (blue laser diodes), radar and communications (heterojunction field effect transistors).[1] Owing to the technological challenge of synthesizing large area bulk substrates, the Gallium Nitride (GaN) used for these semiconductor devices has primarily been heteroepitaxially deposited on dissimilar substrates such as Silicon Carbide, Silicon or sapphire. The accommodation of mismatch between the epitaxy and substrate has resulted in a high density of dislocations and related defects, with an areal density on the order of 108-1010 cm-2, influencing the device relevant physical properties in the GaN such as: thermal conductivity, critical breakdown field, mobility and carrier concentration.
机译:在过去的十年中,氮化镓和相关的III族氮化物半导体已经成为固态照明(蓝色,绿色,白色LED),光学数据存储(蓝色激光二极管),雷达和通信中的电子和光电设备的材料平台。 (异质结场效应晶体管)。[1]由于合成大面积块状衬底的技术挑战,用于这些半导体器件的氮化镓(GaN)主要已异质外延沉积在不同的衬底上,例如碳化硅,硅或蓝宝石。外延与基底之间不匹配的适应导致位错和相关缺陷的高密度,其面密度约为10 8 -10 10 cm < sup> -2 ,影响GaN中与器件相关的物理特性,例如:导热率,临界击穿场,迁移率和载流子浓度。

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