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Fermi level depinning of Ge Schottky contacts using single crystalline MgO

机译:使用单晶MgO的Ge肖特基接触的费米能级脱钉

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Fermi level (FL) pinning at the Ge valence band results in a high Schottky barrier height (SBH) for all metal-Ge contacts [1]. Even though a few groups have demonstrated depinning of the FL by various methods, an explicit explanation of the underlying mechanism is still unclear. One of the most conjectured origins is the metal-induced-gap-states (MIGS) [2], which are energy states in the bandgap of the semiconductor due to the tailing of the metal electron wave functions into the semiconductor. If MIGS plays the dominant role in FL pinning, inserting an ultrathin oxide (UTO) or insulator between the metal and Ge should depin the FL since the UTO can block the tailing of the metal wave function into Ge and thus reduce the MIGS formation. More importantly, the depinning should be increasingly effective when the UTO thickness is increased until a saturation thickness is reached, at which all MIGS are eliminated. Another possible origin of FL pinning is due to the surface states, which arise from unsatisfied dangling bonds or other defects on the semiconductor surface [3]. Depinning could be achieved by passivating those surface states before metal deposition. If surface states play the dominant role in FL pinning, the depinning effect should have a rather weak dependence on the interfacial insulator thickness. However, so far, no experimental results provide an unambiguous deduction of the FL pinning mechanism, mostly due to the lack of an explicit characterization of a high quality metal/Ge or metal/ultrathin oxide/Ge junction, which ideally should be single crystalline, atomically smooth and free of process-induced defects or intermixing. We report the Schottky characteristics of high quality metal/MgO-Ge junctions with the ultrathin MgO epitaxially grown on Ge. We find the depinning effect displays a weak dependence on the MgO thickness, indicating the interface states due to the native defects on Ge surface are likely to play the dominant role in FL pinning.
机译:固定在Ge价带上的费米能级(FL)导致所有金属/ n-Ge触点的肖特基势垒高度(SBH)高[1]。尽管少数小组已通过各种方法证明了FL的固定作用,但尚不清楚对潜在机制的明确解释。最容易被猜想的起源之一是金属诱导的能隙态(MIGS)[2],由于金属电子波功能的拖尾进入半导体,它们是半导体带隙中的能态。如果MIGS在FL钉扎中起主要作用,则在金属和Ge之间插入超薄氧化物(UTO)或绝缘体将使FL钉牢,因为UTO可以阻止金属波函数拖尾到Ge中,从而减少MIGS的形成。更重要的是,当增加UTO厚度直到达到饱和厚度(所有MIGS都消除了)时,销钉固定应越来越有效。 FL钉扎的另一个可能的原因是由于表面状态,这种状态是由不满意的悬空键或半导体表面上的其他缺陷引起的[3]。可以通过在金属沉积之前钝化那些表面状态来实现脱钉。如果表面状态在FL钉扎中起主要作用,则钉扎效应对界面绝缘层厚度的依赖性应该很小。但是,到目前为止,尚没有任何实验结果能明确地推论出FL钉扎机制,这主要是由于缺乏对高质量金属/ Ge或金属/超氧化铀/ Ge结的明确表征,理想情况下,该结应为单晶,原子上光滑,没有过程引起的缺陷或混合。我们报告了外延生长在Ge上的超薄MgO的高质量金属/ MgO / n-Ge结的肖特基特性。我们发现去钉效应显示出对MgO厚度的弱依赖性,表明由于Ge表面的天然缺陷而导致的界面状态可能在FL钉扎中起主导作用。

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