ADHESIVE CHARACTERIZATION AND TESTING FORCRYOGENIC, HIGH SHOCK ELECTRONICS APPLICATIONS

摘要

Adhesives are commonly used in the aerospace industry to stake electrical components onrnprinted wiring assemblies (PWA) to help ensure they survive their vibration environments.rnThese environments include ground testing, launch, deployment, and possibly intentional impactrnwith other objects. The nonlinear response of these adhesives to vibration and temperaturernmakes analysis difficult. Ball Aerospace measured the static and dynamic properties of severalrnadhesives to develop optimum staking solutions for several environments. The mechanicalrnproperties of these adhesives were characterized using Dynamic mechanical analysis (DMA) in arnfrequency spectrum from 1 to 1000 Hz at discrete temperatures between -150℃ to 85℃. Therndata were used to generate storage modulus master curves using the Williams, Landel, and Ferryrn(WLF) time-temperature superposition theory. These WLF master curves are used in structuralrnanalysis to optimize PWA design. Selected adhesives were applied to shock sensitiverncomponents on representative PWAs. Shock testing was performed at up to approximatelyrn10,000 G’s to demonstrate the material performance and validate the structural analysis, therebyrnenhancing the capabilities for complex design of shock-tolerant electronics at Ball Aerospace.