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The Expanding Role of Rapid Thermal Processing in CMOS Manufacturing

机译:快速热处理在CMOS制造中的扩展作用

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The role of single wafer Rapid Thermal Processing (RTP) in semiconductor manufacturing has been steadily expanding over the last 2 decades. There are several reasons for the successful adaptation of this technology. These include more critical requirements by advanced semiconductor technologies with respect to thermal exposure and control, as well as tremendous improvements by the RTP equipment community in resolving some fundamental limitations of the tooling, historically restricting wide spread implementation. From rather humble beginnings, RTP technology has now established itself as indispensable to the production of advanced semiconductor products. We review the history and implementation of RTP technology in semiconductor processing technology at International Business Machines Corporation (IBM) from the late 1980s to recent time.
机译:在过去的20年中,单晶片快速热处理(RTP)在半导体制造中的作用一直在稳步扩大。成功应用此技术有几个原因。这些包括先进的半导体技术在热暴露和控制方面的更严格的要求,以及RTP设备社区在解决工具的一些基本限制方面的巨大改进,这在历史上限制了广泛的实施。从很不起眼的开始,RTP技术就已经确立了自己对于先进半导体产品生产必不可少的地位。我们回顾了1980年代末到最近一段时间间,国际商业机器公司(IBM)在半导体处理技术中RTP技术的历史和实施情况。

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