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Characterization and modeling of enhanced voltage RF MESFETs on 45nm CMOS for RF applications

机译:用于RF应用的45nm CMOS增强电压RF MESFET的表征和建模

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Enhanced voltage silicon metal-semiconductor-field-effect-transistors (MESFETs) have been fabricated on a 45nm SOI CMOS technology with no process changes. MESFETs scaled to Lg = 184nm were fabricated and show a peak fT of 35GHz, current drive of 112mA/mm and breakdown voltages exceeding 4.5V whereas the nominal CMOS voltage was less than 1V on the same process. The devices were characterized from DC to 40GHz and an industry standard TOM3 model has been developed describing their operation. A board level Class AB power amplifier operating at 433MHz was designed, fabricated and measured to have a peak output power of 17dBm and peak PAE of 42.5%. The supply voltage of the PA was more than twice the breakdown voltage of corresponding CMOS on the same semiconductor process. The measured PA results were used to validate the model across different bias and input power level conditions.
机译:增强型电压金属硅半导体场效应晶体管(MESFET)已在45nm SOI CMOS技术上制造,没有任何工艺变化。制造了规模为Lg = 184nm的MESFET,它们的峰值fT为35GHz,电流驱动为112mA / mm,击穿电压超过4.5V,而同一工艺上的标称CMOS电压小于1V。这些器件的特征是从DC到40GHz,并且已经开发出描述其操作的行业标准TOM3模型。设计,制造和测量的板级AB类功率放大器工作于433MHz,其峰值输出功率为17dBm,峰值PAE为42.5%。在同一半导体工艺中,PA的电源电压是相应CMOS击穿电压的两倍以上。测得的PA结果用于在不同的偏置和输入功率水平条件下验证模型。

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