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THE EFFECT OF DISSOCIATED OXYGEN ON THE OXIDATION OF SI, POLYCRYSTALLINE SIC AND LPCVD SI_3N_4

机译:离解氧对SI,多晶SIC和LPCVD SI_3N_4氧化的影响

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摘要

The oxidation of silicon, polycrystalline silicon carbide, and LPCVD silicon nitride in dissociated oxygen and N_2O environments at approximately 900℃ has been investigated. Oxidation in dissociated environments is significantly increased over oxidation in molecular environments. Deal-Grove parabolic (B) and linear (B/A) rate constants are determined for the oxidation of each material. For the times and conditions of these experiments all oxidations were diffusion rate limited, as defined by the Deal-Grove criterion t A~2/(4B). The parabolic rate constants for SiC, Si_3N_4, and Si were 4180 A~2/min, 4151 A~2/min, and 3054 A~2/min, respectively.
机译:研究了在离解氧气和N_2O环境中大约900℃下硅,多晶硅碳化硅和LPCVD氮化硅的氧化。与分子环境中的氧化相比,离解环境中的氧化显着增加。确定每种材料氧化的Deal-Grove抛物线(B)和线性(B / A)速率常数。对于这些实验的时间和条件,如Deal-Grove标准t >> A〜2 /(4B)所定义的,所有的氧化都受到扩散速率的限制。 SiC,Si_3N_4和Si的抛物线速率常数分别为4180 A〜2 / min,4151 A〜2 / min和3054 A〜2 / min。

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