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PHOTOELECTROCHEMICAL INVESTIGATION OF THE ETCHING OF GAN IN H_3PO_4

机译:H_3PO_4中GAN的光化学研究。

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摘要

The photoelectrochemical (PEC) etching of GaN in H_3PO_4 has been studied both as a function of electrolyte pH and illumination intensity. Etching of GaN was found to occur in aqueous H_3PO_4 solutions ranging in concentration from 1.0 x 10~(-3) mol dm~(-3) to 5.0 mol dm~(-3). A peak etch rate of 3.6 nm s~(-1) was observed at a pH of 0.6. The reduced etch rate at lower pH is attributed to mass transport effects in the higher viscosity H_3PO_4 electrolyte and at higher pH it is attributed to the formation of a passivating oxide film. The illumination intensity dependence of the PEC etch rate was also investigated in the intensity range 5 mW cm~(-2) to 50 mW cm~(-2). Etch rates increased in a roughly linear manner with increasing light intensity. However, they saturated at light intensities greater than ~34 mW cm~(-2) indicating a diffusion-limited etching regime. SEM analysis of GaN anodized in 0.001 mol dm~(-3) H_3PO_4 revealed the presence of a cracked oxide film on the surface.
机译:研究了H_3PO_4中GaN的光电化学(PEC)蚀刻与电解质pH和照度的关系。发现GaN的蚀刻发生在浓度为1.0 x 10〜(-3)mol dm〜(-3)至5.0 mol dm〜(-3)的H_3PO_4水溶液中。在0.6的pH下观察到3.6nm s·(-1)的峰值蚀刻速率。在较低pH下降低的蚀刻速率归因于在较高粘度的H_3PO_4电解质中的传质效应,而在较高pH下归因于钝化氧化膜的形成。在5 mW cm〜(-2)至50 mW cm〜(-2)的强度范围内,还研究了PEC蚀刻速率的照明强度依赖性。随着光强度的增加,蚀刻速率以大致线性的方式增加。然而,它们在大于〜34 mW cm〜(-2)的光强度下达到饱和,表明存在扩散受限的蚀刻方式。在0.001 mol dm〜(-3)H_3PO_4中进行阳极氧化的GaN的SEM分析表明,表面存在裂纹的氧化膜。

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