Investigation of the Curing Reaction Mechanism of Polyester and Polyesterimide Wire Enamels

摘要

Stack losses can not be avoided when THEIC-polyesters and THEIC-polyesterimides are used. At temperatures below the temperature of a standard enamelling oven a degradation of the polymers occurres by a beta cleavage of the ethylene glycol ester structure.rnThe stack loss from a THEIC-polyester is leading to a polymer on wire having a higher THEIC content than the initial polyester.rnThe stack loss from a THEIC-polyesterimide is leading to a polymer on wire having a higher imide content than the initial polyesterimide.