Thermal Analysis Applications in Microelectronics Industry

摘要

Profound use of Thermal Analysis techniques in microelectronic industry was startedrnabout 15-20 years ago when the electronic industry moved from traditional ceramicrnpackages to plastic packages to reduce the cost. One of the major concerns with thisrnchange was the reliability of the packaged device. Qualifying these new packages wasrnprimarily based on Finite element modeling and reliability testing. Measurements ofrnphysical properties of these plastic packaging materials were essential to validaterndeveloped models. Thermal analysis techniques, such as DMA, TMA, DSC, Rheology,rnetc., had greatly assisted providing essential critical parameters in plastic packagingrnapplications. Subsequently, usage of the thermal analysis techniques has increasedrngradually not only in the electronic packaging but also in the manufacturing arena,rnaddressing and solving process issues. One of the limitations of the technique is thernsample size. Analyst make a large effort to produce a sample that represents thernmanufacturing process and also fulfills the guidelines of the ASTM methods. Recentrndevelopments in micro-thermal analysis have provided some solutions to thesernlimitations. Motorola has used thermal analysis in a wide array of applications. Thisrnpresentation will cover the following interesting applications:rn1. Optimization of cure profiles for encapsulantsrn2. Monitoring of polyimide crack issuesrn3. Qualification of ceramic lid sealantsrn4. Evaluation of molding compounds.