Dynamic Mechanical Analysis of thermosetting material during curing reaction

摘要

During molecular growth reactions, molecular mobility decreases. Experimentally, anrnincrease in the relaxation time can be detected in the course of isothermal network formation.rnThis process was studied by DMA and DSC using the curing reaction of an epoxy-aminernthermosetting system as an example. In particular, the conversion dependence of the mechanicalrnrelaxation time and the mechanical behavior were investigated and, in the framework ofrnrelaxation processes interpreted and described by models.