首页> 外文会议>Proceedings of the 27th International Conference on Electrical Contacts >Doped Cu/Cr vacuum interrupter contact material enables increased short-circuit interruption performance
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Doped Cu/Cr vacuum interrupter contact material enables increased short-circuit interruption performance

机译:掺杂的Cu / Cr真空灭弧室接触材料可提高短路中断性能

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The predominant contact materials for vacuum interrupters are Cu/Cr composite materials consisting of typically 50 - 75 wt.% copper and 25 - 50 wt.% chromium. Powder metallurgy is used for the mass production of these materials. It is known from experience that the chemical composition of the specific contact material can influence the performance of vacuum interrupters. In the present work it was found empirically, that by addition of a small amount of Si to the Cu/Cr material, the short-circuit interruption performance can be increased substantially. A new process method was developed, which enables a homogeneous and precise Si doping of Cu/Cr at the ppm level. The paper discusses the microstructural features of this new material, their relationship with physical material properties, and the final vacuum interrupter performance in short-circuit interruption tests. A comparison between doped and conventional, un-doped Cu/Cr materials is made.
机译:真空灭弧室的主要接触材料是Cu / Cr复合材料,通常由50-75 wt。%的铜和25-50 wt。%的铬组成。粉末冶金用于这些材料的批量生产。从经验中知道,特定接触材料的化学成分会影响真空灭弧室的性能。在目前的工作中,凭经验发现,通过向Cu / Cr材料中添加少量的Si,可以显着提高短路中断性能。开发了一种新的处理方法,该方法可以使ppm级的Cu / Cr均匀且精确地掺入Si。本文讨论了这种新材料的微观结构特征,它们与物理材料特性的关系以及短路中断测试中最终的真空灭弧室性能。比较了掺杂的和常规的,未掺杂的Cu / Cr材料。

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