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Doped Cu/Cr vacuum interrupter contact material enables increased short-circuit interruption performance

机译:掺杂的Cu / Cr真空断路器接触材料可以提高短路中断性能

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The predominant contact materials for vacuum interrupters are Cu/Cr composite materials consisting of typically 50 - 75 wt.% copper and 25 - 50 wt.% chromium. Powder metallurgy is used for the mass production of these materials. It is known from experience that the chemical composition of the specific contact material can influence the performance of vacuum interrupters. In the present work it was found empirically, that by addition of a small amount of Si to the Cu/Cr material, the short-circuit interruption performance can be increased substantially. A new process method was developed, which enables a homogeneous and precise Si doping of Cu/Cr at the ppm level. The paper discusses the microstructural features of this new material, their relationship with physical material properties, and the final vacuum interrupter performance in short-circuit interruption tests. A comparison between doped and conventional, un-doped Cu/Cr materials is made.
机译:用于真空中断器的主要接触材料是Cu / Cr复合材料,其由通常为50-75重量%的铜和25-50重量%的铬。粉末冶金用于这些材料的批量生产。从经验中已知的特定接触材料的化学成分可以影响真空中断器的性能。在本作工作中,实验地发现,通过向Cu / Cr材料添加少量Si,可以大幅增加短路中断性能。开发了一种新的工艺方法,它能够在PPM水平下实现Cu / Cr的均匀和精确的Si掺杂。本文讨论了这种新材料的微观结构特征,它们与物理材料的关系,以及短路中断测试中的最终真空断续性能。制造掺杂和常规的未掺杂Cu / Cr材料之间的比较。

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