Novel Fabrication Technology for Ultra-Compact Three-Dimensional MMICs

机译：超紧凑型三维MMIC的新型制造技术

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
相似文献
相关主题

摘要

A novel interconnection technology has been developed for ultra-compact three-dimensional (3D) MMICs. A sophisticated 3D interconnection structu has been successfully fabricated using iductively-coupled-plasma etching with a double-layer mask. This technology enables us to realize an ultra-compact MMICs.

机译：已经针对超紧凑的3D（3D）MMIC开发了一种新颖的互连技术。先进的3D互连结构已成功使用带有双层掩膜的感应耦合等离子体蚀刻技术成功制造。这项技术使我们能够实现超紧凑的MMIC。

著录项

来源
《Proceedings of the 27th European solid-state device research conference》|1997年|p.280-283|共4页
会议地点 Stuttgart(DE);Stuttgart(DE)
作者
Suehiro Sugitani; Kiyomitsu Onodera; Shinji Aoyama;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
关键词

相似文献

外文文献
中文文献
专利

1. Three-dimensional passive circuit technology for ultra-compact MMICs [J] . Hirano H., Nishikawa K. IEEE Transactions on Microwave Theory and Techniques . 1995,第12期

机译：适用于超紧凑型MMIC的三维无源电路技术
2. Folded U-Shaped Microwire Technology for Ultra-Compact Three-Dimensional MMIC's [J] . Onodera K., Hirano M. IEEE Transactions on Microwave Theory and Techniques . 1996,第12期

机译：折叠式U形微线技术，用于超紧凑型3维MMIC
3. Quick Development of Multifunctional MMICs by Using Three-Dimensional Masterslice MMIC Technology [J] . Ichihiko TOYODA, Makoto HIRANO, Masami TOKUMITSU IEICE Transactions on Electronics . 1999,第11期

机译：利用三维Masterslice MMIC技术快速开发多功能MMIC
4. Novel Fabrication Technology for Ultra-Compact Three-Dimensional MMICs [C] . Suehiro Sugitani, Kiyomitsu Onodera, Shinji Aoyama European solid-state device research conference . 1997

机译：超紧凑三维MMIC的新型制造技术
5. Design, fabrication and deployment of a miniaturized spectrometer radiometer based on MMIC technology for tropospheric water vapor profiling [D] . Iturbide-Sanchez, Flavio 2007

机译：基于MMIC技术的对流层水蒸气剖面的小型光谱仪辐射计的设计，制造和部署
6. Human Cartilage Tissue Fabrication Using Three-dimensional Inkjet Printing Technology [O] . Xiaofeng Cui, Guifang Gao, Tomo Yonezawa, 2014

机译：使用三维喷墨打印技术制造人体软骨组织
7. Characterization and Modeling of DHBT in InP/GaAsSb Technology for the Design and Fabrication of a Ka Band MMIC Oscillator [O] . S. Laurent, J. C. Nallatamby, M. Prigent, 2012

机译：用于设计和制作Ka波段mmIC振荡器的Inp / Gaassb技术中DHBT的表征和建模
8. GaAs Varactor Diode MMIC (Monolithic Microwave Integrated Circuit) Fabrication Technology [R] . Hughes, B. T., Parker, J. T., Woodward, J. 1987

机译：Gaas变容二极管mmIC（单片微波集成电路）制造技术

Novel Fabrication Technology for Ultra-Compact Three-Dimensional MMICs

摘要

著录项

相似文献

相关主题

期刊订阅