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Engineered surfaces to control secondary electron emission for multipactor suppression

机译:工程化表面可控制二次电子发射,从而抑制多峰效应

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A significant problem for space-based systems is multipactor - an avalanche of electrons caused by repeated secondary electron emission (SEE). The consequences of multipactor range from altering the operation of radio frequency (RF) devices to permanent device damage. Existing efforts to suppress multipactor rely heavily on limiting power levels below a multipactor threshold [1]. This research applies surface micromachining techniques to create porous surfaces to control the secondary electron yield (SEY) of a material for multipactor suppression. Surface characteristics of interest include pore aspect ratio and density. A discussion is provided on the advantage of using electroplating (vice etching) to create porous surfaces for studying the relationships between SEY and pore aspect ratio & density (i.e. porosity). Preventing multipactor through SEY reduction will allow power level restrictions to be eased, leading to more powerful and capable space-based systems.
机译:空基系统的一个重要问题是多极电子-由重复的二次电子发射(SEE)引起的电子雪崩。从改变射频(RF)设备的操作到永久性损坏设备,多脚开关的后果不一。抑制多脚架的现有努力在很大程度上取决于将功率水平限制在多脚架阈值以下[1]。这项研究应用表面微机械加工技术来创建多孔表面,以控制用于多峰抑制的材料的二次电子产率(SEY)。感兴趣的表面特征包括孔的长径比和密度。讨论了使用电镀(副蚀刻)产生多孔表面以研究SEY与孔纵横比和密度(即孔隙度)之间的关系的优点。通过降低SEY来防止多脚架将使功率水平限制得到缓解,从而导致功能更强大,功能更强大的太空系统。

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