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ASIC Physical Design Flow: Power Saving Opportunities on Interconnection Components

机译:ASIC物理设计流程:互连组件上的节能机会

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摘要

The ever-increasing density of SoC (System on Chip) has made their power consumption an issue in their own right. We present a specific power reduction technique at physical design stage of the digital design SoC conception flow: Capacitance-Toggle rate weighting which aims at reducing the switching power of the interconnection inside the Integrated Circuit. We implemented the technique and obtained experimental results on designs done on 28 nm technology node. The new placement power aware performs an improvement on average 12% in interconnection power and a 4% average in the total power. This method has been inducting into a Place and Route EDA (Electronic Design Automation) tool.
机译:SoC(片上系统)密度的不断提高本身就使功耗成为一个问题。我们在数字设计SoC概念流程的物理设计阶段提出了一种特定的功耗降低技术:电容-切换速率加权,旨在降低集成电路内部互连的开关功率。我们实施了该技术,并在28 nm技术节点上完成的设计上获得了实验结果。新的布局功率感知功能使互连功率平均提高了12%,总功率平均提高了4%。该方法已引入到布局和布线EDA(电子设计自动化)工具中。

著录项

  • 来源
  • 会议地点 Saidia(MA)
  • 作者单位

    Laboratory of Systems Engineering, National School of Applied Sciences, Ibn Tofail University, 14000 Kenitra, Morocco,ICDS Department, Mentor Graphics, Rabat, Morocco;

    Laboratory of Systems Engineering, National School of Applied Sciences, Ibn Tofail University, 14000 Kenitra, Morocco,ICDS Department, Mentor Graphics, Rabat, Morocco;

    Laboratory of Systems Engineering, National School of Applied Sciences, Ibn Tofail University, 14000 Kenitra, Morocco;

    ICDS Department, Mentor Graphics, Rabat, Morocco;

    Laboratory of Electrical Engineering and Telecommunication Systems, National School of Applied Sciences, Ibn Tofail University, 14000 Kenitra, Morocco;

    Laboratory of Systems Engineering, National School of Applied Sciences, Ibn Tofail University, 14000 Kenitra, Morocco;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Physical design; Power reduction; EDA; Low power Integrated circuit;

    机译:物理设计;降低功率; EDA;低功耗集成电路;

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