首页> 外文会议>Power Semiconductor Devices amp; IC's, 2009. ISPSD 2009 >A novel 80V-class HV-MOS platform technology featuring high-side capable 30V-gate-voltage drift-NMOSFET and a trigger controllable ESD protection BJT
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A novel 80V-class HV-MOS platform technology featuring high-side capable 30V-gate-voltage drift-NMOSFET and a trigger controllable ESD protection BJT

机译:一种新颖的80V级HV-MOS平台技术,具有高侧能力的30V栅极电压漂移NMOSFET和触发器可控ESD保护BJT

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An 80 V-class high voltage (HV) MOS platform integrating two types of 80 V-class novel structure devices, a high-side capable 30 V-gate-voltage drift-NMOSFET and an ESD protection BJT, is described. The 30 V-gate-voltage drift NMOSFET features a stacked source-side structure consisting of LOCOS, an extended source region, and a waved p+ stopper, enabling both off-state and on-state drain breakdown voltage to surpass 80 V. Despite its high gate voltage endurance of over 30 V, the specific on-resistance (Rsp) reaches as low as 275 mohm*mm2. The ESD protection BJT features a buffer base region, enabling the trigger voltage to surpass 100 V and the ESD endurance voltage to reach 4 kV-HBM. The trigger voltage can be controlled from 78 to 102 V by changing the buffer base size. These devices can be integrated with only one additional mask step and do not sacrifice the excellent performance of the other high and low voltage devices.
机译:描述了一个集成了两种类型的80 V类新型结构器件的80 V类高压(HV)MOS平台,即具有高侧能力的30 V栅极电压漂移NMOSFET和ESD保护BJT。 30 V栅极电压漂移NMOSFET具有堆叠的源极侧结构,该结构由LOCOS,扩展的源极区和波形的p +限位器组成,使截止状态和导通状态的漏极击穿电压均超过80V。栅极耐压超过30 V,比导通电阻(Rsp)低至275 mohm * mm2。 ESD保护BJT具有一个缓冲基极区,使触发电压超过100 V,使ESD耐久电压达到4 kV-HBM。通过改变缓冲器的基本尺寸,可以将触发电压控制在78至102 V之间。这些设备仅可与一个附加的掩模步骤集成在一起,并且不会牺牲其他高低压设备的出色性能。

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