首页> 外国专利> ESD PROTECTION CIRCUIT OF SILICON CONTROLLED RECTIFIER STRUCTURE CAPABLE OF OPERATING AT LOW TRIGGERING VOLTAGE

ESD PROTECTION CIRCUIT OF SILICON CONTROLLED RECTIFIER STRUCTURE CAPABLE OF OPERATING AT LOW TRIGGERING VOLTAGE

机译:可在低触发电压下工作的硅控整流器结构的ESD保护电路

摘要

The present invention is formed on a predetermined region of the semiconductor substrate, the semiconductor substrate as to provide an electrostatic discharge protection circuit of the operation trigger voltage is LVTSCR structure high at the same time per unit area of ​​the current conduction efficiency, while good stability is low, the first conductivity type a well region of a second conductivity type, said well region and the constant is distance from the gate insulating film and a gate electrode, a first diffusion region of the first conductivity type formed in said well region, said gate electrode stacked on the selected surface of the semiconductor substrate side of the semiconductor is formed below the substrate surface on the gate electrode and a second diffusion region of a conductivity type, and said semiconductor substrate and said well region and in contact with said first diffusion region on the gate electrode the other side connected to a common ground with over formed and because it appears the second conductivity type third includes a diffusion region, an electrostatic discharge protection circuit having a LVTSCR structure according to the invention of the current conduction characteristics and the operating voltage are all superior characteristics associated with the input and output pads via the resistive element it is well suited to high-speed, low-voltage, electrostatic discharge protection device of a semiconductor integrated circuit. ; ESD, electrostatic discharge protection circuit, SCR, LVTSCR, motion trigger voltage, current conduction efficiency
机译:本发明形成在半导体衬底的预定区域上,该半导体衬底为提供静电触发保护电路的操作触发电压是LVTSCR结构,同时每单位面积的电流传导效率较高,而良好的稳定性是低的,第一导电类型是第二导电类型的阱区,所述阱区和常数是距栅绝缘膜和栅电极的距离,第一导电类型的第一扩散区形成在所述阱区中所述堆叠在半导体的半导体衬底侧的选定表面上的栅电极形成在栅电极上的衬底表面和导电类型的第二扩散区的下方,并且所述半导体衬底和所述阱区并与所述接触栅电极上的第一扩散区的另一侧连接到共同的地上,上方形成一个由于第二导电类型似乎包括扩散区域,因此具有根据本发明的LVTSCR结构的静电放电保护电路的电流传导特性和工作电压都是经由电阻与输入和输出焊盘相关联的优良特性元件非常适合半导体集成电路的高速,低压,静电放电保护器件。 ; ESD,静电放电保护电路,SCR,LVTSCR,运动触发电压,电流传导效率

著录项

  • 公开/公告号KR100679943B1

    专利类型

  • 公开/公告日2007-02-08

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20040091537

  • 发明设计人 곽국휘;김상용;

    申请日2004-11-10

  • 分类号H01L27/04;

  • 国家 KR

  • 入库时间 2022-08-21 20:33:00

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