Producing micron level exit holes or vias interconnects for applications involving critical drug delivery and microelectronic packaging is no easy task. The design of excimer beam delivery optics, the physical system configuration, construction materials used and laser material interaction play significant roles in the ultimate process results. As a result of higher density microelectronic package designs and the critical nature of drug delivery, these processes need to be robust and repeatable to a 3σ level. Many companies who look to source new laser systems to meet these new demands come face to face with the reality of this dilemma. Matching laser process to material selection sets the stage for a successful integration, of most concern is the materials ability to resolve the features desired and the ease of cleaning the debris once the features are formed. This paper will present application specific laser beam delivery methods, focus/image stability techniques, beam shaping and inline inspection technology to stabilize such processes and present statistical and quality data on a process that was developed to form (1) one micron exit holes through 25 micron thick polyimide for a critical drug delivery application. The data will cover a 31 day period of processing.
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