Full range IGBT and MOSFET modules based on latest chips technology

摘要

StarPower developed a product line of IGBT and MOSFET modules for industrial applicationsrnin 2005, and since then has responded to market needs by releasing successive series of newrnmodules realizing low loss and high power density.rnThe latest SPT+ chip technology from ABB has been successfully adopted in standard 34mm、rn48mm、62mm series, 17mm height compact 45mmx107mm (C5), 62mm×122mm (C6) andrn150mm×162mm (C7) medium power series and 140mmx130mm packages high power seriesrnoptimized for motor drive applications. These modules offer very low power loss、soft switchingrnwaveform、low thermal resistance、ruggedness and reliability.rnThe Trench + Field Stop chip technology from IR has also been adopted in StarPower’srncompact packages L1 (PIM)、L2 (PIM) and A1 (IPM)，optimized for small motor drives andrnwhite goods applications.rnThe advanced planar and trench MOSFET chips from IR have been adopted in series of lowrnprofile packages with low stray inductance designed with a height of 16mm and optimized forrnhigh switching frequency applications.rnThis paper discusses the performance、reliability and product lineup of StarPower’s IGBT andrnMOSFET modules.