EconoPACK? + A package with enhanced characteristics

摘要

Increasing the efficiency of high power frequency converters is one of the main challenges in powerrnelectronics of the last years. The power semiconductors have to follow this requirement with reducedrnlosses by state of the art silicone and by increasing the power density to higher current ratings. Thernincreased power density will be also driven by rising operational temperature of the system and especiallyrnof the power module. Since many industrial power module types have been standardized overrnthe years the module developers is given the task to fulfill also these requirements including the increasernof the power density within an existing module footprint. The solutions to this task involve thernintegration of new chip technologies as well as the introduction of new package technologies.