Department of Materials Science Engineering National Chiao Tung University Hsinchu Taiwan R.O.C.;
Department of Materials Science and Engineering University of California Los Angeles Los Angeles CA USA;
Department of Materials Science Engineering National Cheng Kung University Tainan Taiwan R.O.C.;
Intermetallic compounds; Soldering; Copper;
机译:(111)取向和纳米孪晶铜上微凸点的单向生长
机译:Cu籽晶层晶粒取向对<111>取向纳米孪晶Cu生长的影响
机译:(111) - 纳米丝型Cu底族界面金属间化合物的异常生长
机译:Microbumpsη-Cu_6sn_5在(111)定向和纳米丝Cu中的η-cu_6sn_5的单向增长的微观结构控制
机译:铂上低电位沉积银受控生长的机理研究(111)。
机译:(111)定向和纳米孪晶铜的结合界面微观结构与铜-铜接头的剪切强度之间的相关性
机译:Cu种子层晶体取向对<111-纳米丝型Cu生长的影响