DEVELOPMENT OF A TRANSIENT PACKAGE COOLING TECHNOLOGY USING LOW MELTING POINT ALLOY

摘要

This paper describes a new transient cooling technology of electronic package by using a phase changing material (PCM), which is useful to develop high-density package. A low cost alloy composed of Bi/Pb/Sn/, of which the melting point of each individual material component is less than 373 Kelvin, were used as PCM. The thermal behavior of PCM has been investigated by keeping the substrate back surface temperature to its melting point temperature for several minutes, during which the PCM has changed from the original solid state to the liquid state. The performance of PCM is predicted using the thermal network method and verified with experimental measurements. The result demonstrates also that the thermal network method can serve as a useful engineering tool for the thermal design of electronic package cooled with PCM.