NONDESTRUCTIVE INSPECTION OF A SMALL AREA DELAMINATION IN IC PACKAGES BY MICROWAVE IMAGING

摘要

The delamination, which may occur between the chip pad and the encapsulant resin in IC packages, was inspected by microwave imaging technique. An open-ended coaxial line sensor was used to increase the spatial resolution of the measurement. The microwave image was generated using the measured amplitude of the reflection coefficient. The full and part delaminations were detected by the microwave amplitude image. The results were compared with those obtained by scanning acoustic tomography. The good inspection capability and no necessity of any coupling medium make this technique having wide prospects for the integrity assessment of IC packages.