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PROGRESS IN MEDIA COMPATIBLE PRESSURE SENSORS

机译:介质兼容压力传感器的研究进展

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The ability of MEMS devices to operate in potentially corrosive environments will be of the critical importance for the introduction of these devices into new markets. The most common MEMS devices, pressure sensors, have been traditionally specified for dry, non-corrosive gas environments. However, automotive, industrial, and medical applications require exposure of pressure sensors to a variety of liquids such as fuels, oils, acids, bases, and bodily fluids. When a pressure aensor is exposed to these environments, the metallic regions of a sensor die may corrode resulting in catastrophic failures and, in less drastic cases, in electrical output alteration. It is evident that MEMS pressure sensors can not operate in such environments without some form of protection or passivation. This ability of an electronic device, pressure sensor in this case, to perform its specified electromechanical function in chemical, electrical and thermal conditions is called media compatibility; and has evolved into a new MEMS packaging subcategory. The challenge for the pressure sensor media compatible package is to protect a device and, at the same time, enable its interaction with the environment to allow for the transmission of pressure. For this reason, the traditional IC packaging technologies can not be used or need to be modified. A variety of package-level media compatibility methods have emerged and some of them have been successfully employed in certain applications. The most commonly used methods are stainless steel diaphragm and barrier coatings including gels and thin, conformal coatings. Despite numerous proposed techniques, the realization of media compatible MEMS package for every application remains elusive. A partial reason for this is the lack of reliable testing techniques for rapid screening of coating candidates and processes, and early detection of corrosion failures. The development of such techniques is one of the key conditions for the further advancements or breakthroughs in media compatible pressure sensors.
机译:MEMS设备在潜在腐蚀性环境中运行的能力对于将这些设备引入新市场至关重要。传统上,最常见的MEMS器件即压力传感器已指定用于干燥,无腐蚀性的气体环境。但是,汽车,工业和医疗应用需要将压力传感器暴露于多种液体中,例如燃料,机油,酸,碱和体液。当压力传感器暴露在这些环境中时,传感器芯片的金属区域可能会腐蚀,从而导致灾难性故障,在较不严重的情况下,也会导致电输出变化。很明显,如果没有某种形式的保护或钝化,MEMS压力传感器将无法在此类环境中运行。电子设备(在这种情况下为压力传感器)在化学,电气和热条件下执行其指定的机电功能的能力称为介质兼容性;并已发展成为新的MEMS封装子类别。与压力传感器介质兼容的包装所面临的挑战是保护设备,同时使其与环境相互作用以允许压力传输。因此,传统的IC封装技术无法使用或需要修改。出现了许多程序包级媒体兼容性方法,其中一些已成功地用于某些应用程序中。最常用的方法是不锈钢隔膜和阻隔涂层,包括凝胶和薄的保形涂层。尽管提出了许多建议的技术,但对于每种应用而言,实现与媒体兼容的MEMS封装仍然很困难。造成这种情况的部分原因是缺乏可靠的测试技术来快速筛选候选涂层和工艺,以及及早发现腐蚀故障。此类技术的发展是与介质兼容的压力传感器取得进一步进步或突破的关键条件之一。

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