The reliability of surface mount devices depends heauily upon the interconnections (solder) between component and printed wire board. Accurately predicting the reliability to impact design is one of the major challenges to quality and reliability engineers in the electronic packaging industry. Often these reliability predictions are made with the aid of a finite element model, which contains a nonlinear constitutive model. The disturbed state concept (DSC) is a unified constitutive model which allows a hierarchical use of the model for factors such as elastic, plastic, and creep strains, micro-cracking (damage) and softening and stiffening. In this paper the DSC model is calibrated for two solders, 60
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