Reduced thermal models of electronic packages for systemlevel design applications

摘要

An automated procedure has been developed to generate reduced thrmal models of electronic packages and demonstrated for a plastic quad flat pack (PQFP) package and a plastic ball grid array (PBGA) package using a commercial high fidellity CFD tool. A resistance network is constructed as the physical thermal model of the entire package to predict its junction temperature. While the major functionality of the reduced model is to predict the junction temperature of the package, its application in a system may result in inaccurate or even erronus prediction of temperatures of neighboring components. This issue has been examined by the authors. Also discussed are the definitions of the resistance network topology and the full models of the packages, impacting the accuracy of predicted junction temperatures.