A multi-scale finite volume thermal/flow solver and a high order accuracy finite element stress/deformation code are employed to simulate thermal and thermal stress characteristics of an array of proton implanted top surface emitting lasers cooled b a copper heat sink.Heat generated within VCSEL devices is computed using a self-consistent thermal-electrical-optical device simulator. The anisotropic thermal property is considered for the package model. Temperature dependency of critical device and material properties and multiple heat generation mechanisms are included. A two-way coupling between the package-scale thermal solver and device simulator is accmplished by an it erative procedure, Localized laser heating configurations are examined. Effects of device spacing and array sizes are also evaluated. Degraded laser performance is found due to the thermal crosstalk. Thermal stresses due to the CTE mismatch and thermal gradient are calculated for an array package. Significantthermal stresses due to the CTE mismatch between the heat sink and the substrate are observed.
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