首页> 外文会议>Pacific Rim International Conference on Advanced Materials and Processing(PRICM 5) pt.3; 20041102-05; Beijing(CN) >Orientation Distributions of Ferroelectric BLT Films for High-Density Semiconductor Memories
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Orientation Distributions of Ferroelectric BLT Films for High-Density Semiconductor Memories

机译:高密度半导体存储器中铁电BLT薄膜的取向分布

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Issues of ferroelectric high-density memories (>64Mb) indispensable for upcoming ubiquitous era have been on the cell integration less than 0.1um~2 and reliabilities. Thus nanoscale control of microstructures of ferroelectric films with large switching polarization has been one of the issues to obtain the uniform electrical properties for realization of high-density memories. In this study the grain orientations and distributions of BT-based films by spin-on coatings were examined by an electron backscatter diffraction (EBSD) technique. Ferroelectric domain characteristics by a piezoresponse force microscope (PFM) were also performed to study the dependence of reliabilities on the grain orientations and distributions.
机译:在即将到来的无处不在的时代,铁电高密度存储器(> 64Mb)必不可少的问题在于单元集成度小于0.1um〜2和可靠性。因此,具有大的开关极化的铁电薄膜的微结构的纳米级控制已成为获得用于实现高密度存储器的均匀电性能的问题之一。在这项研究中,通过电子背散射衍射(EBSD)技术检查了旋涂涂层对BT基薄膜的晶粒取向和分布的影响。还通过压电响应力显微镜(PFM)进行了铁电畴特征的研究,以研究可靠性对晶粒取向和分布的依赖性。

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