Abstract: This paper details several patented optical backplane interconnect system design for harsh environments. These optical backplanes provide an extremely high bandwidth interconnect structure capable of supporting today's and tomorrow's optical-electrical transducer technology, permitting the insertion of the next generation processing technology without upgrading/replacing the backplane interconnect structure itself. Additionally, the design of several robust, high optical density, cylindrical connectors is discussed, which extend the high-bandwidth optical connectivity beyond the backplane, permitting the integration of multiple physically federated 'boxes' into one computationally integrated system. !4
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