Incorporation of MT ferrule and ribbon technology into optical backplane systems

摘要

This paper details several patented optical backplane interconnect system design for harsh environments. These optical backplanes provide an extremely high bandwidth interconnect structure capable of supporting today's and tomorrow's optical-electrical transducer technology, permitting the insertion of the next generation processing technology without upgrading/replacing the backplane interconnect structure itself. Additionally, the design of several robust, high optical density, cylindrical connectors is discussed, which extend the high-bandwidth optical connectivity beyond the backplane, permitting the integration of multiple physically federated 'boxes' into one computationally integrated system.