Cryogenic adhesive testing for the NIRCam optical bench assembly

摘要

The Near Infrared Camera (NIRCam) Optical Bench Assembly (OBA) is a I-220H beryllium adhesively-bonded structure designed to operate at 35K. To support design activities, an adhesive testing program was performed, with particular emphasis on adhesive allowables at 35K. The geometries of the samples were designed to emulate the structural features of the OBA. The testing program is described, test data presented, and the results applied to the NIRCam OBA.