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3D shearography for surface strain analysis

机译:用于表面应变分析的3D剪切成像

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摘要

Abstract: The development of a time-division-multiplexed 3D digital shearography instrument is described. The system provides simultaneous measurement of the in-plane and out-of-plane deformation gradients, allowing full surface strain analysis. The object under investigation is sequentially illuminated from three directions by three fiber coupled high power laser diode sources, and imaged onto a CCD camera through a single shearing interferometer. The pulsing of the sources is synchronized with the camera frame rate. Phase stepping is achieved using laser diode wavelength tuning combined with a path length imbalance in the shearing interferometer. The source pulsing schedule and image acquisition are controlled from a PC. An analysis of the optimum illumination geometry is presented. The performance of the system is evaluated on laboratory test samples. !13
机译:摘要:描述了时分多路复用3D数字剪切仪的开发。该系统可以同时测量面内和面外变形梯度,从而可以进行完整的表面应变分析。被测物体依次由三个光纤耦合的高功率激光二极管源从三个方向照亮,并通过单个剪切干涉仪成像到CCD相机上。源的脉冲与摄像机帧频同步。通过使用激光二极管波长调谐结合剪切干涉仪中的路径长度不平衡来实现相位步进。源脉冲计划和图像采集由PC控制。给出了最佳照明几何形状的分析。该系统的性能是在实验室测试样品上评估的。 !13

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