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1/f noise in SOI buried oxides and alternative dielectrics to SiO_2

机译:SOI掩埋氧化物和SiO_2替代电介质中的1 / f噪声

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摘要

We have studied the 1/f noise and the radiation response of transistors with silicon-on-insulator (SOI) buried oxides, and with Al_2O_3/SiOxNy/Si(100) gate dielectrics. The former is significant for understanding the response of advanced SOI transistor structures (e.g., double gate devices), and the latter is important for the incorporation of high-K gate dielectrics into advanced MOS processes. The 1/f noise of MOSFETs fabricated on silicon-implanted SOI buried oxides shows little change after 1 Mrad(SiO_2) irradiation. Silicon implantation creates shallow electron traps in the buried oxide of the SOI devices, leading to improved radiation tolerance, but also additional noise and bias instabilities. Whether the traps that lead to these instabilities are filled or empty does not significantly affect the 1/f noise of the back-channel transistor. Low frequency noise in the strongly coupled front-to-back (quasi double-gate) mode of device operation is also investigated, and found to help mitigate the 1/f noise in fully depleted SOI MOSFETs. The decrease in noise is associated primarily with an increase in the number of carriers in the channel for this quasi double-gate mode of operation. In transistors with high-K dielectrics, the low-frequency noise is significantly larger than typically observed for high-quality thermal SiO_2 thin films.
机译:我们已经研究了具有绝缘体上硅(SOI)掩埋氧化物和Al_2O_3 / SiOxNy / Si(100)栅极电介质的晶体管的1 / f噪声和辐射响应。前者对于理解高级SOI晶体管结构(例如,双栅极器件)的响应非常重要,而后者对于将高K栅极电介质并入高级MOS工艺至关重要。在1 Mrad(SiO_2)辐照后,用硅注入的SOI掩埋氧化物制造的MOSFET的1 / f噪声几乎没有变化。硅注入会在SOI器件的掩埋氧化物中形成浅电子陷阱,从而提高了辐射耐受性,但同时也带来了额外的噪声和偏置不稳定性。导致这些不稳定性的陷阱被填充还是被填充都不会显着影响反向通道晶体管的1 / f噪声。还研究了器件操作的强耦合前后对(准双栅极)模式下的低频噪声,发现该噪声有助于缓解完全耗尽的SOI MOSFET的1 / f噪声。对于这种准双门操作模式,噪声的降低主要与信道中载波数量的增加有关。在具有高K电介质的晶体管中,低频噪声明显大于通常对高质量热SiO_2薄膜观察到的噪声。

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