首页> 外文会议>Ninth International Symposium on Silicon Materials Science and Technology, Vol.2, May 13-17, 2002, Philadelphia >IMPACT OF STATE-OF-THE-ART Cz SUBSTRATES ON THE CURRENT-VOLTAGE CHARACTERISTICS OF SHALLOW p-n JUNCTIONS
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IMPACT OF STATE-OF-THE-ART Cz SUBSTRATES ON THE CURRENT-VOLTAGE CHARACTERISTICS OF SHALLOW p-n JUNCTIONS

机译:最新的Cz衬底对浅p-n结电流流特性的影响

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摘要

This paper studies the impact of state-of-the-art Czochralski (Cz) substrates on the current-voltage (I-V) characteristics of shallow n~+-p-well junctions surrounded by polysilicon encapsulated local oxidation of silicon (PELOX). The Cz substrates contain different densities of Crystal Originated Particles (COP) and interstitial oxygen (O_i). The overall yield is excellent. The yield can be improved when the leakage current (I_R) is dominated by the peripheral (I_P), corner (I_C) or area (I_A) component, in descending order by reducing the COP density. Reducing the O_i density improves the yield when I_R is dominated by I_A and I_P but reduces it when I_K is dominated by I_C. The I-V characteristic of the good low-leakage diodes is not much different for different wafers. This allows to conclude that the processing-induced defect density in a 0.18 μm CMOS technology is higher than the defect density in the starting material.
机译:本文研究了最新的切克劳斯基(Cz)衬底对被多晶硅包裹的硅局部氧化(PELOX)包围的浅n〜+ -p阱结的电流-电压(I-V)特性的影响。 Cz基板包含不同密度的晶体起源粒子(COP)和间隙氧(O_i)。总体产率极好。当泄漏电流(I_R)由外围(I_P),边角(I_C)或面积(I_A)分量控制时,通过降低COP密度,可以提高产量。当I_R以I_A和I_P为主时,降低O_i密度可提高产量,但当I_K以I_C为主时则降低产量。良好的低泄漏二极管的I-V特性对于不同的晶圆没有太大差异。这可以得出结论,在0.18μmCMOS技术中,加工引起的缺陷密度高于起始材料中的缺陷密度。

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