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AIGaN/GaN based heterostructures for MEMS and NEMS applications

机译:适用于MEMS和NEMS应用的基于AIGaN / GaN的异质结构

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With the increasing requirements for microelectromechanical systems (MEMS) regarding stability, miniaturization and integration, novel materials such as wide band gap semiconductors are receiving more attention. The outstanding properties of group Ⅲ-nitrides offer many more possibilities for the implementation of new functionalities and a variety of technologies are available to realize group Ⅲ-nitride based MEMS. In this work we demonstrate the application of these techniques for the fabrication of full-nitride MEMS. It includes a novel actuation and sensing principle based on the piezoelectric effect and employing a two-dimensional electron gas confined in AIGaN/GaN heterostructures as integrated back electrode. Furthermore, the actuation of flexural and longitudinal vibration modes in resonator bridges are demonstrated as well as their sensing properties.
机译:随着对微机电系统(MEMS)的稳定性,小型化和集成化的要求不断提高,诸如宽带隙半导体之类的新型材料正受到越来越多的关注。 Ⅲ族氮化物的卓越性能为实现新功能提供了更多的可能性,并且有多种技术可用于实现基于Ⅲ族氮化物的MEMS。在这项工作中,我们演示了这些技术在全氮化物MEMS制造中的应用。它包括一种基于压电效应的新颖的致动和传感原理,并采用局限在AIGaN / GaN异质结构中的二维电子气作为集成背电极。此外,还演示了共振桥中挠曲和纵向振动模式的致动及其感测特性。

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