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Integrated high sensitivity displacement sensor based on micro ring resonator

机译:基于微环谐振器的集成式高灵敏度位移传感器

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A novel integrated high sensitivity displacement sensor based on micro ring resonator is described. It includes the high sensitivity of optical sensors and the compactness and potential for mass production of the MEMS sensors. In this design, GaAs-Al0.6Ga0.4As platform was chose for its high-index contrast. A bus waveguide couples to a micro ring resonator and they are integrated on the supporting point of a cantilever. We can obtain the value of displacement sensor by means of monitoring the changes in the transmission spectrum of the ring resonator due to the photo-elastic effect and the change of circumference as the deformation of cantilever. This method has high sensitivity and can be used in harsh environments such as ultra-high vacuum (UHV) systems and electromagnetically active environments. Finite Element Method (FEM) simulations were carried out to obtain the optimum sensor design and Beam Propagation Method (BPM) simulation was used to obtain the transfer characteristics of the bus waveguide and the micro ring resonator. In this paper, operation principles and sensitivity analysis are discussed in detail. Different types of ring resonators are studied in order to achieve high sensitivity and the radius of 20 mum of ring resonator is chose eventually. Further more, because of the fabrication limit, the FIB (Focused Ion Beam) is used to etch the gap between waveguide and ring resonator accurately after RIE etching, which can control the gap to less than 100 nm, and the whole manufacturing process is also presented.
机译:描述了一种基于微环谐振器的新型集成高灵敏度位移传感器。它包括光学传感器的高灵敏度以及MEMS传感器的紧凑性和大规模生产的潜力。在本设计中,选择GaAs-Al 0.6 Ga 0.4 As平台作为其高折射率对比。总线波导耦合到微环谐振器,它们集成在悬臂的支撑点上。通过监测由于光弹性效应引起的环形谐振器传输光谱的变化以及悬臂变形引起的周长变化,可以得到位移传感器的值。此方法具有很高的灵敏度,可用于恶劣的环境中,例如超高真空(UHV)系统和电磁活动环境。进行了有限元方法(FEM)仿真以获得最佳的传感器设计,并使用了光束传播方法(BPM)仿真获得了总线波导和微环谐振器的传输特性。在本文中,详细讨论了操作原理和灵敏度分析。为了达到较高的灵敏度,研究了不同类型的环形谐振器,最终选择了半径为20μm的环形谐振器。再者,由于制造上的限制,在RIE刻蚀后,利用FIB(聚焦离子束)来精确刻蚀波导与环形谐振器之间的间隙,可以将间隙控制在100nm以下,整个制造过程也是提出了。

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