Rensselaer Polytechnic Institute, Troy, NY 12180-3590;
Rensselaer Polytechnic Institute, Troy, NY 12180-3590;
Rensselaer Polytechnic Institute, Troy, NY 12180-3590;
Rensselaer Polytechnic Institute, Troy, NY 12180-3590;
University of Wisconsin-Madison, Madison, WI 53706-1691;
University of Wisconsin-Madison, Madison, WI 53706-1691;
University of Wisconsin-Madison, Madison, WI 53706-1691;
Brimrose Corporation of America, 19 Loveton Circle, Sparks, MD 21152;
Brimrose Corporation of America, 19 Loveton Circle, Sparks, MD 21152;
U.S. Army Research Laboratory, 2800 Powder Mill Rd., Adelphi, MD 20783;
U.S. Army Research Laboratory, 2800 Powder Mill Rd., Adelphi, MD 20783;
U.S. Army Research Laboratory, 2800 Powder Mill Rd., Adelphi, MD 20783;
CdTe epitaxy; dislocation reduction; nanoheteroepitaxy; block co-polymer lithography; interference lithography;
机译:由于多孔缓冲液的重建,增强了退火过程中在多孔硅上生长的锗中的螺纹位错密度的降低
机译:分子束外延生长的HgCdTe外延层中的穿线和错配位错运动
机译:ZnTe缓冲层对(001)GaAs分子束外延生长CdTe外延层结构质量和形貌的影响
机译:在硅底物缓冲纳米结构上生长的CDTE脱蛋白的脱位减少
机译:使用热循环退火在硅片上生长的碲化镉和汞镉碲化镉的脱位密度降低
机译:卤化物气相外延在锥形截肢型蓝宝石衬底上生长的α-GA2O3癫痫脱位的减少
机译:快速热退火对III-V副词在单片硅片的螺纹脱位密度的影响
机译:不同退火周期的si(211)衬底上生长的CdTe外延层缺陷的共焦micro-pL映射。