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Characterisation Techniques for the Study of Nanoscale Polymeric Systems in Two-and Three-Dimensions

机译:二维和三维研究纳米级聚合物体系的表征技术

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摘要

The development of polymer-based materials, composites and devices is more intense than ever, and so techniques and methods for their characterisation have become more powerful, giving new insights into the spatial relationships between heterogeneous nanostructures. A case in point is the application of state-of-the-art focused ion beam technology (FIB), in combination with high-performance scanning electron microscopy (SEM), allowing us to generate cross-sections into bulk material and create a series of sequential images. For polymeric systems, this may require the simultaneous use of cryogenic temperatures in order to minimise any structural distortions, and strategies are also required to overcome problems associated with charge build-up when dealing with such electrically insulating specimens. With appropriate software, two-dimensional images can be correlated and volume-rendered into a three-dimensional representation. In addition, site-specific lamellar specimens can be made, for observation in the (scanning) transmission electron microscope (S/TEM), with the advantage that FIB cutting through hard-soft interfaces poses fewer difficulties compared to traditional ultra-microtomy.
机译:聚合物基材料,复合材料和器件的开发比以往任何时候都更加激烈,因此表征它们的技术和方法变得更加强大,从而为异质纳米结构之间的空间关系提供了新的见解。一个典型的例子是将最新的聚焦离子束技术(FIB)与高性能扫描电子显微镜(SEM)结合使用,使我们能够将截面生成为块状材料并创建一系列顺序图像。对于聚合物系统,这可能需要同时使用低温,以最大程度地减少任何结构变形,并且还需要采取策略来克服在处理此类电绝缘样品时与电荷积累相关的问题。使用适当的软件,可以将二维图像进行关联并进行体积渲染为三维表示。此外,可以制作特定位置的层状样本,以便在(扫描)透射电子显微镜(S / TEM)中进行观察,与传统的超薄切片机相比,FIB切穿硬-软界面的难度较小。

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