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Analysis of the Total Resistance in Standard and Strained FinFET Devices With and Without the Use of SEG

机译:使用和不使用SEG的标准和应变FinFET器件中的总电阻分析

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In this work the total resistance (Rt) behavior is experimentally studied in standard and strained (CESL and sSOI) triple-gate nFinFET devices with and without the use of Selective Epitaxial Growth (SEG). It was verified that the devices with SEG present a better behavior of Rt even for standard devices if compared with strained ones without the use of SEG. For short channel FinFETs (L < 100 nm), the CESL ones present the lowest value of R_t if SEG is used. However, for long channel FinFETs (L > 420 nm), sSOI shows the best behavior with and without the use of SEG. The effective mobility degradation factor (MDF) has also been analyzed showing that devices with SEG and sSOI present the lowest degradation.
机译:在这项工作中,在标准和应变(CESL和sSOI)三栅极nFinFET器件中,无论是否使用选择性外延生长(SEG),都要通过实验研究总电阻(Rt)行为。经验证,与不使用SEG的拉紧设备相比,带有SEG的设备即使对于标准设备也具有更好的Rt性能。对于短通道FinFET(L <100 nm),如果使用SEG,则CESL的R_t值最低。但是,对于长通道FinFET(L> 420 nm),使用或不使用SEG时,sSOI表现出最佳性能。还分析了有效迁移率降低因子(MDF),显示具有SEG和sSOI的设备的降级最低。

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