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THE EFFECTS OF TEXTURE AND DOPING ON THE YOUNG'S MODULUS OF POLYSILICON

机译:质地和掺杂对多晶硅杨氏模量的影响

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摘要

Polysilicon films deposited by low pressure chemical deposition (LPCVD) are the most widely used structural material for microelectromechanical systems (MEMS). However, the structural properties of LPCVD polysilicon films are known to vary significantly, depending on deposition conditions as well as post-deposition processes. This paper investigates the effects of phosphorus doping and texture on Young's modulus of polysilicon films. Polysilicon films are depostied at 585℃, 605℃, and 625℃ to a thickness of 2μm. Specimens with varying phosphorus doping levels are prepared by diffusion doping at various temperatures and times using both POCI_3 and phosphorsilicate glass (PSG) as the source. Texture is measured using an X-ray diffractometer. Young's modulus is calculated by taking the average of the values calculated from the resonant frequencies of four-different size lateral resonators. Our results show that Young's modulus of diffusion doped polysilicon films decreases with increasing doping concentration, and increases with increasing <111> texture.
机译:通过低压化学沉积(LPCVD)沉积的多晶硅膜是用于微机电系统(MEMS)的最广泛使用的结构材料。然而,已知LPCVD多晶硅膜的结构性质会显着变化,这取决于沉积条件以及沉积后工艺。本文研究了磷掺杂和织构对多晶硅膜杨氏模量的影响。多晶硅膜在585℃,605℃和625℃下的厚度为2μm。通过使用POCI_3和磷硅酸盐玻璃(PSG)作为源,在不同温度和时间进行扩散掺杂,可以制备出具有不同磷掺杂水平的样品。使用X射线衍射仪测量织构。杨氏模量通过取从四倍尺寸横向谐振器的谐振频率计算出的值的平均值来计算。我们的结果表明,扩散掺杂的多晶硅膜的杨氏模量随掺杂浓度的增加而降低,并随<111>织构的增加而增加。

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  • 会议地点 San Francisco CA(US)
  • 作者单位

    School of Electrical Engineering and Inter-university Semiconductor Research Center, Seoul National University, San 56-1, Shinlim-dong, Kwanak-gu, Seoul 151-742, Korea;

    School of Electrical Engineering and Inter-university Semiconductor Research Center, Seoul National University, San 56-1, Shinlim-dong, Kwanak-gu, Seoul 151-742, Korea;

    School of Electrical Engineering and Inter-university Semiconductor Research Center, Seoul National University, San 56-1, Shinlim-dong, Kwanak-gu, Seoul 151-742, Korea;

    School of Electrical Engineering and Inter-university Semiconductor Research Center, Seoul National University, San 56-1, Shinlim-dong, Kwanak-gu, Seoul 151-742, Korea;

    School of Electrical Engineering and Inter-university Semiconductor Research Center, Seoul National University, San 56-1, Shinli;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 结构;材料;
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