From CD to 3D Sidewall Roughness Analysis with 3D CD-AFM

摘要

The continuous shrink of device's dimensions has reached such level that parameters such as line edge and line width roughness (LER and LWR) become non negligible for advance process development. Therefore, it is now mandatory to work with 3D metrology techniques in order to fulfil roadmap requirements. The goal of this paper is to show the potentiality of the CD-AFM as a real predictable 3D metrology in order to accelerate advance devices development by understanding and solving the strong limitations at a certain point of each technological steps (lithography, front-end etching...). Line edge and line width roughness are part of this future 3D metrology.