Copper electrodeposition on carbon film electrodes

摘要

The reaction and nucleation mechanisms of the electrodeposition of copper from ammoniacal solutions were investigated by cyclic voltammetric and chronoamperometric techniques on carbon film electrodes in an ammoniacal bath. The process of copper formation is carried out in two steps. The first is associated to reduction of complex couple Cu(NH_3)_4~(2+) to Cu(NH_3)_2~+ this processes is controlled by diffusion, whereas in second correspond to the reduction of Cu(NH_3)_2~+ to Cu(0) in wide potential range. Theoretical models of electrocrystallization reported in literature were used to analyze the experimental current transients. The analysis of the experimental current transients shows a three-dimensional growth (3D) for the metallic copper with a great number of monolayer; this indicated that in these experimental conditions of work massive copper deposits was obtained.