Institute of Microelectronics,Peking University,Beijing 100871,P.R'China;
National Key Laboratory of Science and Technology on Reliability Physics and Application Technology of Electrical Component,the 5th Electronics Research Institute of the Ministry of Industry and Information Technology;
Guangzhou 510610;
P'R'China;
Institute of Microelectronics,Peking University,Beijing 100871,P.R'China;
Institute of Microelectronics,Peking University,Beijing 100871,P.R'China;
Institute of Microelectronics,Peking University,Beijing 100871,P.R'China;
National Key Laboratory of Science and Technology on Reliability Physics and Application Technology of Electrical Component,the 5th Electronics Research Institute of the Ministry of Industry and Information Technology;
Guangzhou 510610;
P.R'China;
Institute of Mi;
Cushion materials:Aluminum foam:Metal rubber:Microaccelerometer;
机译:开发包装用的环保缓冲材料-纸和空气等清洁缓冲材料“ Slim Cushion”的实际应用-
机译:使用缓冲曲线数据来预测包装缓冲材料的振动传递特性
机译:中国高速列车座垫材料的热解特性研究
机译:抗冲击率下微城径垫材料的实验研究
机译:厚度小于一英寸的膨胀聚合物缓冲垫材料的性能。
机译:高山生态系统如何维持气垫群落:高山气垫植物繁殖的回顾与案例研究
机译:缓冲材料性能评估研究
机译:温度敏感动态缓冲模型的开发和验证选择块体缓冲材料的等厚度。第三卷