An On-Chip Temperature-Controlling Technology for Silicon Micro-Gyroscope

摘要

In this paper,a novel design of silicon micro-gyroscope with a micro-heater inside the package has been given to keep the working temperature of the gyroscope constant so as to minimize the effect of the environment temperature on the performances of the gyroscope. Firstly, the structure of the gyroscope package was given. Secondly, with a heater inside the package, the characteristics of the gyroscope, such as frequency, coupled vibrations, temperature distribution and thermal equilibrium time, were predicted with the aid of the finite element tool, ANSYS. Finally, the surfaces of the package were optimized with anti-radiation shields covering on them. As a result, when the gyroscope was subjected to the environment temperature of 20, ℃ its temperature could reach the equilibrium state of about 84℃ within 2 minutes with the temperature difference between the anchor and the proof mass being about 2. ℃ Besides, if the environment temperature was varied from -40 to ℃ 80, the heating power ℃ consumption was degraded from 1.27625W to 0.09712W. However, this design needs improving to decrease the heating power consumption and the equilibrium time.