首页> 外文会议>Memory Workshop (IMW), 2012 4th IEEE International >Mobility Enhancement of Peripheral PMOSFET Using e-SiGe Source and Drain in Sub-50nm DRAM
【24h】

Mobility Enhancement of Peripheral PMOSFET Using e-SiGe Source and Drain in Sub-50nm DRAM

机译:50nm以下DRAM中使用e-SiGe源极和漏极增强外围PMOSFET的迁移率

获取原文
获取原文并翻译 | 示例

摘要

The mobility enhanced pMOS transistors have been successfully implemented into sub-50nm DRAM for the first time. The uni-axial strained channels were embodied by filling the recessed source / drain with epitaxial SiGe film. Mobility boosting and reduced external resistance enabled pMOS transistors to increase saturation current by 20%, and retarded boron diffusion reduced DIBL by 17mV/V compared to control process without degradation of DRAM cell data retention time characteristics. The local variation of threshold voltage is suppressed to the same level of control process. The hot electron induced punch-through (HEIP) degradation can be controlled to negligible degree.
机译:迁移率增强型pMOS晶体管首次成功地应用于50nm以下的DRAM中。通过用外延SiGe膜填充凹陷的源极/漏极来实现单轴应变通道。与控制工艺相比,迁移率的提高和外部电阻的降低使pMOS晶体管能够将饱和电流提高20%,并且硼扩散延迟使DIBL降低了17mV / V,而不会降低DRAM单元数据保留时间的特性。阈值电压的局部变化被抑制到相同水平的控制过程。可以将热电子诱导的穿通(HEIP)降解控制在可以忽略的程度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号