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Total Contamination Control: The Minienvironment Era

机译:全面污染控制:最小环境时代

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摘要

Semiconductor manufacturers clearly recognize that shrinking geometries in semiconductor devices require more stringent process and contamination control. The application of isolation technology for the reduction and control of particulate contamination levels has moved from the development and evaluation stage to its current status as a preferred alternative for new semiconductor manufacturing facilities.rnA system based on Standard Mechanical Interfaces (SMIF), which uses clean isolation technology to protect the integrity of the wafers during processing, storage and transportation within the facility, is described. An extension of the same principle of isolation, based on the SMIF-technology, enables a selected inert environment to be furnished in the process tool area as well as in the transport and storage containers. The technology enables control of particles, oxygen and water vapor levels {to the 10 PPM range), organic vapor and gas phase contaminant. The capabilities of the minienvironment technology and its benefits will be analyzed.
机译:半导体制造商清楚地意识到,缩小半导体器件的几何尺寸需要更严格的工艺和污染控制。隔离技术在减少和控制颗粒物污染水平方面的应用已从开发和评估阶段转变为目前的状态,成为新的半导体制造设施的首选替代产品。基于标准机械接口(SMIF)的系统,使用清洁描述了在工厂内处理,存储和运输期间保护晶片完整性的隔离技术。基于SMIF技术的相同隔离原理的扩展,使得可以在过程工具区域以及运输和存储容器中提供选定的惰性环境。该技术可以控制颗粒,氧气和水蒸气水平(至10 PPM范围),有机蒸气和气相污染物。将分析小型环境技术的功能及其优势。

著录项

  • 来源
    《》|1995年|269-276|共8页
  • 会议地点 Austin TX(US)
  • 作者

    Salem Abuzeid;

  • 作者单位

    Minienvironments Business Unit Kato Road Asyst Technologies, Inc. Fremont, CA;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 电子元件、组件;
  • 关键词

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