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How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing?

机译：3D集成技术如何启用Exascale级高性能计算的高级计算节点？

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Supercomputers will soon achieve Exascale-level computing performances mainly thanks to the introduction of innovative hardware technologies around the processors. This article explains architectural and performance evolutions and describes how 3D integration technologies have allowed heterogeneity and increased bandwidth that are decisive for hardware innovations contributing to Exascale.

机译：超级计算机即将达到ExaMAsale-Level计算性能，主要感谢处理器周围的创新硬件技术。本文介绍了架构和性能的演变，并描述了3D集成技术如何允许多侵扰和增加的带宽，这对于有助于EnaScale的硬件创新是决定性的。

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《International Electron Devices Meeting 》|2020年|15.3.1-15.3.4|共4页
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D. Dutoit; P. Coudrain; P.-Y. Martinez; P. Vivet; J. Charbonnier; A. Garnier; D. Lattard; S. Chéramy; E. Guthmuller; A. Philippe; Y. Thonnart; F. Clermidy;
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Performance evaluation; Technological innovation; Three-dimensional displays; Program processors; High performance computing; Hardware; Supercomputers;

机译：绩效评估;技术创新;三维显示器;程序处理器;高性能计算;硬件;超级计算机;

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How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing?

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