Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration

机译：面向多维数据集大小的计算节点：先进的包装概念可实现极端3D集成

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Novel heat removal and power delivery topologies are required to enable `extreme 3D integration' with cube-sized compute nodes. Therefore, a technology roadmap is presented supporting memory-on-logic and logic-on-logic in the medium and long-term, by (i) dual-side cooling and integrated voltage regulators, and (ii) interlayer cooling and electrochemical power delivery.

机译：需要新颖的散热和功率传输拓扑结构，以实现与立方体大小的计算节点的“极端3D集成”。因此，提出了一种技术路线图，该路线图通过以下方式支持中长期的逻辑存储和逻辑存储：（i）双面冷却和集成稳压器，以及（ii）层间冷却和电化学供电。

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《IEEE International Electron Devices Meeting》|2017年|1-4|共4页
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T. Brunschwiler; G. Schlottig; A. Sridhar; P. Bezerra; P. Ruch; N. Ebejer; H. Oppermann; J. Kleff; W. Steller; M. Jatlaoui; F. Voiron; Z. Pavlovic; P. McCloskey; D. Bremner; P. Parida; F. Krismer; J. Kolar; B. Michel;
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Density measurement; Power system measurements; Inductors; Cooling; Heating systems; Silicon; Through-silicon vias;

机译：密度测量;电力系统测量;电感器;冷却;加热系统;硅;硅通孔;

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4. Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration [C] . T. Brunschwiler, G. Schlottig, A. Sridhar, IEEE International Electron Devices Meeting . 2017

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Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration

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