Interformational Exfoliation of Ti_3AIC_2 Induced by Cu

摘要

An interformational exfoliation behavior of the layered Ti_3AlC_2 induced by copper was firstly investigated via a "Cu-Ti_3AlC_2-Cu" sandwich sample infiltration-sintered at 1100℃ to 1200℃. It was found that the molten Cu accelerates Ti_3AlC_2 to decompose, induces the interformational exfoliation to generate, and consequently forming a sub-micro-layered structure making up of TiC_(0.67) layers and Cu-Al alloy layers within a Ti_3AlC_2 grain. This interformational exfoliation behavior can be attributed to a topotactic mechanism due to the outward diffusion of Al the entering of Cu.